CFM SYSTEM FEATURES
- No expensive ion source or plasma source required for high ion current energy generation
- No trace elements of T or Fe within coated films normally generated from ion or plasma source
- No need for deposition rate controller, crystal monitor or X-Y sweep controller
- Film thicknesses are simply time/ power controlled.
- Superior water vapor removal with Meissner trap and fast cool down/ rapid defrost chiller
- Repeatable coating uniformities, across the substrate, substrate to substrate, within the batch and run to run
- Up to 3x substrate load capacity over electron beam evaporation coaters within identical footprint
- Quick substrate load/ unload with ability to mix substrate sizes within the same load
- System is readily adaptable for flat, circular, irregular size or sheet type substrates
- Simplified machine design with only two internal moving parts – substrate drum & indexing shutter
- Full PLC with touch panel control along with factory Ethernet link
- Readily removeable and easy to clean stainless steel shielding
- Slide and tilt cathode feature which allows for quick target material change
- Stainless steel vacuum chamber with viewports and exterior water cooled channel cooling
- Scaleable technology – four standard coating system platforms available – others on request
- Adaptable technology – transferable from drum type to roll coater or inline system