CFM SYSTEM FEATURES
- No expensive ion source or plasma source required for high ion current energy generation
- No trace elements of T or Fe within coated films normally generated from ion or plasma source
- No need for deposition rate controller, crystal monitor or X-Y sweep controller
- Film thicknesses are simply time/ power controlled.
- Superior water vapor removal with Meissner trap and fast cool down/ rapid defrost chiller
- Repeatable coating uniformities, across the substrate, substrate to substrate, within the batch and run to run
- Up to 3x substrate load capacity over electron beam evaporation coaters within identical footprint
- Quick substrate load/ unload with ability to mix substrate sizes within the same load
- System is readily adaptable for flat, circular, irregular size or sheet type substrates
- Simplified machine design with only two internal moving parts – substrate drum & indexing shutter
- Full PLC with touch panel control along with factory Ethernet link
- Readily removeable and easy to clean stainless steel shielding
- Slide and tilt cathode feature which allows for quick target material change
- Stainless steel vacuum chamber with viewports and exterior water cooled channel cooling
- Scaleable technology – four standard coating system platforms available – others on request
- Adaptable technology – transferable from drum type to roll coater or inline system
PATENTED CFM BENEFITS
- Provides 10x greater kinetic energy without the high heating effect normally generated in electron beam evaporation
- Allows room temperature coatings – ideal for sensitive substrates as polymers, plastics, glass
- Spectrally stable coatings
- Amorphous film microstructure
- Near bulk film densification
- Ultra-smooth surface topography
- Better adherent coatings
- Typical substrate uniformity of <±1%
- Low film stress
- Efficient and complete film oxidation with minimal absorption
- Maximum deposition rates due to pulsed DC reactive sputtering process
- Highest utilization of source materials. Four inches vs. one meter source to substrate distance. More material is deposited onto the substrates, not the chamber walls
- Repeatable machine performance and long term reliability with little maintenance needed